LAMELLA (SINGLE)

LAMELLA (SINGLE)

During electroless plating process, Tokyo Seisakusho add and disperse suitable amount of small particles (SiC etc.) and fix it together.
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Lamella (single)

Material Thickness

0.15mm,  0.2mm

Width

25mm,  30mm,  35mm,  40mm,  50mm,  60mm

Edge Thickness

50μm,  60μm,  70μm,  75μm,  80μm,  90μm

Shape

Lamella (single)          

Plating Thickness

5μm,  7μm,  10μm,  12μm,  15μm

Hardness

Hv900,  Hv700
Others
LAMELLA (DOUBLE)

LAMELLA (DOUBLE)

PARTIAL PLATING

PARTIAL PLATING

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